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KT
Micro has assembled a top-notch mixed-signal design team in the world. Most of
the key members have more than 10 years of mixed-signal design experiences with
world’s leading semiconductor companies. Many of them led core design teams in
their previous companies before joining KT Micro. Their mixed-signal design
experiences cover a frequency range from DC to 20GHz. Their technical strength
has been demonstrated in the following areas:
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System
level experiences The team has
extensive experiences working on highly integrated mixed-signal systems. They
are experienced in system definition, partition, specification, behavioral
modeling. They are experts in handling practical issues such as signal
integrity, power distribution, frequency allocation, noise isolation, etc. that
are critical to successful system designs and integrations. Some example design
wins as results of their strong leadership and technical excellence are:
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GSM RFCMOS mixed-signal processor
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E3/T3 AFE
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DVB mixed-signal processor
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10GB Ethernet transceiver
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High
speed designs The team has lots of
successful design experiences on various high speed high performance
mixed-signal designs including very high speed ADCs, DACs, PLLs and Serdes, etc.
Some of their latest designs are:
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10-bit 200MSPS CMOS ADC
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8-bit 400MSPS CMOS ADC
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10-bit 240MSPS CMOS Video DAC
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8-bit 800MSPS CMOS DAC
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40 GB Transceiver
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10 GB TIA/LIA combo
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High
resolution/accuracy designs KT
Micro’s designers never overlook a single detail when it comes to
high-resolution designs. They dig down to every fF or mW
of parasitics as they may affect accuracy. Part of their successful designs
include:
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16-bit, 44KSPS audio SD
ADC
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15-bit 500KSPS dual-channel SD
ADC
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16-bit single-bit audio SD
DAC
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16-bit multi-bit, 8-OSR SD
DAC
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12-54MHz PLL with jitter < 66 ps
peak-to-peak
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9.5~12.5GHz PLL with jitter <
1ps RMS
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High
density designs It’s always very
challenging when designing high-density large-scale mixed-signal ICs. KT
Micro’s design team has unique design experience in handling such designs as
large-scale pixel arrays which often require delicateness and innovations to
solve issues like uniformity, parasitics, noise coupling, leakage, jitter
accumulation and simulation time, etc. As an example, a cutting edge design that
was led by one of our key members is:
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OLED color micro-display chip with
pixel array of 852x600x3
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Low-power
designs As a must in portable
applications, low power designs are very desirable for today’s ICs fabricated
in deep sub-micron technology, where the issue is further challenged by higher
density, lower power supply and higher leakage. KT Micro’s designers had many
successful bench-mark low power designs like:
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16-bit voice band ADC consumes 30uA
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852x600x3 OLED color micro-display
chip consumes 200mW (pixel current between 250pA and 25nA)
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